After introducing in succession apparatus and instrument pavilion, electronics manufacturing equipment pavilion and photo electricity pavilion, the 68th CEF will introduce grandly the brand-new electronics material pavilion in hall 5 with an area of 5,000 sqm. The pavilion will focus on magnetic materials, supporting raw materials and special purpose facilities and instruments of magnetic materials, magnetos, electronic transformers. It is another decision made in line with the purpose and purport of “specialization” and “demonstrating perfectly electronics industry chain”.

　　The electronics material pavilion, which will be introduced in the coming exhibition, will integrate all the electronics material exhibitors under CEF, and work hand in hand with important cooperative partners in the material industry such as No.9 Institute of China Electronic Technology Group Corporation, Magnetic Materials & Parts Branch of China Electronic Components Association, Professional Information Web of Magnetic Materials and Components of Ministry of Information Industry, National Committee of Magnetic Component and Ferrite Materials Standardization Technology, Magnetic Products Quality Supervision and Inspection Center of Ministry of Information Industry and China Southwest Magnetic Science and Technology Consultation Center. These important cooperative partners in the magnetic materials industry have allied themselves to CEF, which will boost CEF’s speciality and authority in the material industry.

　　In over 2,000 exhibitors of CEF, there are about 100 electronics material enterprises. And world famous material corporations such as American Sealed Air Corporation, Emerson & Cuming and Hangzhou Youbang Solder Metals Co.,Ltd. attended the 67th CEF. American Sealed Air Corporation, the largest protective packing materials and facilities manufacturer in the world, created “But bLe Wrap” bubble pad materials over 40 years ago, replacing the traditional way of waste paper packaging. Emerson & Cuming is a global supplier of high end conductive and non-conductive adhesive, encapsulating epoxy embedment glue and special dope as well as the technology leader of special polymers such as epoxy, silicone, polyurethane and acrylic acid.